New way of cooling chips!

[Jorden]

Scomp, I do have pets, a guinea pig and a rabbit, but they are never in the same room as my PC is, and even if they were, they would have a hell of a time getting on top of my desk

Jorden.

[This message has been edited by Jorden (edited 02 March 2000).]

[Mark F]

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At any rate, I'd like to have a Peltier based on this new alloy
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Ummmm, wouldn't it be better used in the processor; around the connections. That way rather than using the ceramic, hopeing to transfer the heat out to be carried off by whatever cooling (HSF, peltier, water, etc); it would be cooled inside the ceramic.

Hope my idea is understandable.

Mark F.


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OH NO, my retractable cup holder swallowed a DVD...
and burped out a movie

[Scout255]

The artical you have mentioned mearly talks about a new alloy that is more efficant at transfering heat from the hotside to the cold side.
IE: Today a 172 watt pelter (4X the average heat produced by todays chips) consumes 277 watts of electricity, and dumps 277 watts of heat on the hot side + what ever the cpu was produceing.
This new materical may allow newer TEC's to function at 100% efficancy (or even more) i.e a 172 watt pelter reqireing only 172 watts of electricity to run.
This new technoligy would also not do away with heatsinks, although it may allow them to get smaller.
Because of improved efficancy less heat would be produced than todays modules, allowing the average intel heatsink to cool it correctly.
As for it doubleing the chips clock rate, this would be pretty hard to beleve. If you used these new TEC's to cool a chip far enough below 0 to double its clock rate (about -30 to -40 would be minimum) you would end up with ALLOT of new issues. I.E stress put on cpu from expanding and contracting from the tec being turned on and off, condensation on the cpu since it is being cooler so much, and the TEC eventually failing (they last on average 70000 cycles (on to off)).
Also, doubleing the clock speeds would be dependant on the motherboard too as it must be capable of the high multipliers (15 X for a 2 ghz chip running @ 133 mhz fsb) as current motherboards rarely ever go above 10X.
in short: this material is excellent at replaceing current TEC's, but i doubt it will ever become mainstream.
Also, rembember that tec's are not small things, the smallest i have seen are 2.3 mm tall X 5mm X 5mm so i doubt you could make them small enouph to put in between the connects in a cpu.