Hi everyone. I am going to epoxy some heatsinks onto the memory chips on my MAX to help it for overclocking. I am also considering additional cooling on the backside of the card where the core is, since the PCB gets pretty warm there. I know some people have done with, but I'd like some opinions on what you think and how well it works. I'm between just epoxying a small hetsink behind the core, or epoxying a low-profile heatsink+fan there. Is there any danger to covering those resisters and with the thermal epoxy for the additional backside sink? Also, for those who have replaced the default fansink on the front of the board, which ones are best to use? I don't want anything huge.. just one of the coolers that will fit on the cip and into the mount holes with some thermal paste. I'm between the tennmax and a couple others I've seen. I'd greatly appreciate any feedback. Thanks!

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