Hi,
i have a G400 16MB SH @ 161 CORE.
I have several heatsinks on it, f.e. a pentium1 heatsink+cooler on the back of the card so that the chip gets some cooling from the other side. I put some adhesive(?, i couldnt find a better translation) tape on the other side and sticked the heatsink on it. So far so good. the tape has a conductivity of 1.0 W/mk. I got a new paste today which has a conductivity of 2.9 W/mK! I know i will get some Mhz extra (dont ask why i need em ) when i put the new paste on the card instead of the tape. The only thing i worry about is: will i fry my chip because of a short connect(?) on my chip.
Here are some values of that paste (i tried to translate it in english):
Conductivity : 2,90 W/mK
'Indegredients' : Silicon / filled up with metal oxyd
Thickness/density(?) : 2,8 g /cm3
Dielectric (sth.) : 18 kV/mm
Specific resistance : > 10^15 Ohm/cm
point where the whole thing starts to burn : 280°C (ISO 2592)
works at a temperature of: -50°C bis +200 °C
thx for your help !
i have a G400 16MB SH @ 161 CORE.
I have several heatsinks on it, f.e. a pentium1 heatsink+cooler on the back of the card so that the chip gets some cooling from the other side. I put some adhesive(?, i couldnt find a better translation) tape on the other side and sticked the heatsink on it. So far so good. the tape has a conductivity of 1.0 W/mk. I got a new paste today which has a conductivity of 2.9 W/mK! I know i will get some Mhz extra (dont ask why i need em ) when i put the new paste on the card instead of the tape. The only thing i worry about is: will i fry my chip because of a short connect(?) on my chip.
Here are some values of that paste (i tried to translate it in english):
Conductivity : 2,90 W/mK
'Indegredients' : Silicon / filled up with metal oxyd
Thickness/density(?) : 2,8 g /cm3
Dielectric (sth.) : 18 kV/mm
Specific resistance : > 10^15 Ohm/cm
point where the whole thing starts to burn : 280°C (ISO 2592)
works at a temperature of: -50°C bis +200 °C
thx for your help !
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