It is unbelievable! the thermal conducting material of G400 Max is 2 layers of thin thermal pads with an alumimun sheet at the middle, only 2 sides of the thermal pad had direct contact witht he hot chip...After I removed it and applied some thermal compound I found temperature of the HSF is much higher than before. What does matrox think,Is it wants all G400 Max owners to have the chip overheats and burnt so that the users would buy its new products?
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Under the HSF of G400 Max...
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Well, the card was bought from my cousin for 50 bucks. He's really so lucky to have bought such a card... And I think the case shouldn't be occur only on this card but at least for a whole batch, is it right?
[This message has been edited by George YS (edited 21 May 2001).]
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I saw the same thing on my G400, two driedup patches of thermal goo, with a alu sheet in between.
Still I'm not complaining as my G400 core does 190 without a fan"That's right fool! Now I'm a flying talking donkey!"
P4 2.66, 512 mb PC2700, ATI Radeon 9000, Seagate Barracude IV 80 gb, Acer Al 732 17" TFT
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<font face="Verdana, Arial, Helvetica" size="2">Originally posted by CHHAS:
I saw the same thing on my G400, two driedup patches of thermal goo, with a alu sheet in between.
Still I'm not complaining as my G400 core does 190 without a fan </font>
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